OM13497UL

OM13497UL

Bild ass fir Referenz, kontaktéiert eis w.e.g. fir dat richtegt Bild ze kréien

Fabrikant beschwéiert Part OM13497UL
Fabrikant beschwéiert NXP Semiconductors
Beschreiwung SURFACE MOUNT TO DIP EVALUATION
Kategorie Kits
Famill Prototyping Brieder, Fabrikatioun Kits
Liewenszyklus: New from this manufacturer.
Liwwerung: DHL FedEx Ups TNT EMS
Bezuelen T/T Paypal Visa MoneyGram Western Union
Datasheet OM13497UL PDF

Disponibilitéit

Op Lager 980655
Eenzelpräis $ 23.86000

OM13497UL Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

OM13497UL Spezifikatioune

Typ Beschreiwung
Serie:-
Package:Bulk
Deel Status:Active
Kit Typ:Adapter, Breakout Boards
Quantitéit:18 Pieces (3 Values - 6 Each)
Pak ugeholl:HTSSOP, VFBGA, XFBGA
Spezifikatioune:SMD to DIP
Zuel vun Positiounen:24

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

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